IEEE International Conference on Additively Manufactured Electronic Systems

The 2026 IEEE International Conference on Additively Manufactured Electronic Systems addresses research, development, and applications of additive and advanced manufacturing for electronic systems.

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IMEC - Interuniversitair micro micro-electronica centrum will present the outcomes from the MULTIMOLD project that faces the issue of recycling for advanced multi-functional IME devices.

The project integrates a "design to disassemble" strategy to enhance material recovery.

• Selective Dissolution: Plastics like PC and TPU are selectively dissolved, allowing them to be separated from the solid phase, which contains conductive circuitry, electronic components, and other polymers.
• Purity and Recovery: This method produces PC granulate with low metal content (< 0.5 m%) and mechanical properties very similar to pure PC.
• Metal Recovery: The remaining solid residue contains high concentrations of metals, which can be recovered using techniques such as hydro- or pyrometallurgy or electrochemistry.

Conclusion and Future Outlook

The MULTIMOLD project successfully introduces methods to recover both polymers and metals from IME devices. Future work will focus on developing more complex demonstrators and improving the purity of recycled polymers to enhance optical transparency.

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The event is organised by KU Leuven Additive Manufacturing Institute & Sponsored by IEEE Council on RFID and IEEE Microwave Theory and Technology Society

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DISCOVER THE ABSTRACT 

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